The Technology Solutions R&D group seeks an individual experienced in advanced RFIC packaging techniques. Qualified candidates will work with a team of RF and mixed-signal integrated circuit designers in developing complex, miniature modules. Typical modules integrate one or more integrated circuits that operate at RF or clock speeds of 20GHz or more. Primary challenges consist of isolating digital noise from RF circuits, avoiding cross-talk between RF sections, minimizing signal loss and interface mismatch, and managing thermal dissipation. Qualified candidates will work with in-house and third-party vendors in developing packages. Material trades need to be performed, such as wiring density, layers, thermal, loss at high frequencies, suitability to integrate distributed element filters into the substrate, CTE, and cost. Candidates will be expected to support internal and customer design reviews with written and oral presentations. 

Qualifications 
� BSEE required, MSEE or PhD desired, RF/Microwave device, circuit or system concentration, > 10 yrs experience in RFIC/mixed-signal module design and development 
� Experience with flip-chip, System on Chip (SoC), high density interconnect (HDI), multi-chip module (MCM), and System in Package (SiP) packaging approaches 
� Ability to vertically integrate passives and filter structures into the package 
� Thorough understanding of packaging material selection trades - low loss microwave substrates, ceramics, organics, LCP's 
� Understanding of thermal issues, ability to work with thermal modeling engineer to assess thermal viability of packaging concepts 
� Design for robust signal integrity - isolation of analog/digital sections, packaging mode suppression, ground and power supply distribution methodologies 
� Proficiency in modeling and simulation tools Ansof HFSS, Cadence Virtuoso/Allegro, Microwave Office, SONNET, Agilent ADS Momentum, and Autocad 
� Strong written and oral communication skills

BAE Systems is the premier global defense and aerospace company, delivering a full range of products and services for air, land, and naval forces, as well as advanced electronics, information technology solutions, and customer support services. With 105,000 employees worldwide, BAE Systems had 2008 sales of $34.4 billion.

Electronic Solutions, based in Nashua, New Hampshire, provides systems and products that maximize the effectiveness and safety of fighting forces and first responders. Its offerings include infrared countermeasures and electronic protection systems for military and civilian aircraft; information management systems; signal acquisition, analysis, and exploitation systems that optimize use of the electromagnetic spectrum by friendly forces while denying its use by adversaries; interoperable communications systems for firefighters and other first responders; thermal weapon sights; precision targeting systems; situational awareness systems for ground vehicles; night-vision systems; identification friend or foe systems; and radiation-hardened electronics. Electronic Solutions also includes the group’s Advanced Systems & Technology unit, which joins EI&S with government research organizations and industry to develop and demonstrate innovative system concepts in such areas as situational awareness, communications and networking, and precision targeting.

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